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Feature Introduction:
MOLEGRIDTM Tough D is a high-strength DLP light-curing resin with low odor emission, rapid prototyping, high success rate of printing, high strength after molding, and good bending resistance. It is suitable for various DLP equipment in the 405 nm band.
MOLEGRIDTM Tough D is suitable for occasions that require high strength while maintaining certain toughness, for instance, the design of components such as fasteners and gears are particularly suitable for scientific research institutions, enterprise technology centers, individual players, and studios that require high material performance.
Basic Physical Properties:
| Type | TDS | |||||||||||
| Density g/cm3 @25℃ | Viscosity cps @25℃ | Tensile strength Mpa | Tensile modulus Mpa | Elongation at break | Flexural strength Mpa | Flexural modulus Mpa | Impact value J/m | Heat deflection temperature ℃@0.45MPa | Hardness | Ashes | Tear strength kN/m | |
| Tough D | 1.10-1.20 | 750-850 | 41.00 | 1800.00 | 66.00% | 63.00 | 1609.00 | 165.00 | 55.00 | 80D | ||
