THE K10™ PC

THE K10™ PC is a high heat-resistance PC material for industrial FDM/FFF 3D printers. With mechanical properties comparable to normal PC materials, its softening temperature is increased by more than 30°C, which is close to PEI, but easier to print than PEI.

Temperature Resistance Strength Toughness Rigidity Ease of Printing Z-axis Strength

Suggested Printing Parameters

Nozzle temperature310 ~ 350℃
Bed temperature140 ~ 180℃
Chamber temperature80 ~ 150℃
Bed modificationNO & High temperature glue
Active cooling fanOFF%
Layer height0.2mm
Shell thickness≥ 0.8mm
Print speed30-60mm/s
Settings are based on a 0.4mm nozzle.

Technical Data Sheet (TDS)

Material Properties Typical Value Test Method
Melt temperature (HDT)²~280℃ISO 11357
Melt flow rate (MFR)¹30~35g/10minISO 1133
Heat deflection temperature (HDT)²163℃ISO 75
Vicat softening temperature (VST)³176℃ISO 306
Density1.18~1.20g/cm³ISO 1183
OdorOdorless/
SolubilityInsoluble in water/

1. Test conditions: T= 330℃; m= 2.16kg.

2. Test conditions: 0.45MPa; 120℃/h.

3. Test conditions: 10N; 120℃/h.

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