Suggested Printing Parameters
| Nozzle temperature | 400 ~ 450℃ |
| Bed temperature | 110 ~ 220℃ |
| Chamber temperature | 40~60 or 90~200℃ |
| Bed modification | NO |
| Active cooling fan | 0~100% |
| Layer height | 0.2mm |
| Shell thickness | ≥ 0.8mm |
| Print speed | 30~60mm/s |
Technical Data Sheet (TDS)
| Material Properties | Typical Value | Test Method |
|---|---|---|
| Melt temperature (HDT)² | ~340℃ | ISO 11357 |
| Melt flow rate (MFR)¹ | 14~18g/10min | ISO 1133 |
| Heat deflection temperature (HDT)² | 150℃(before annealing)/ 182℃(after annealing) | ISO 75 |
| Vicat softening temperature (VST)³ | 170℃ | ISO 306 |
| Density | 1.28g/cm³ | ISO 1183 |
| Odor | Odorless | / |
| Solubility | Insoluble in water | / |
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Weight options:
: 1kg, 3kg, 5kg
THE K11™ PEEK
Offers exceptional mechanical and thermal properties, making it suitable for a wide range of applications. This material is inherently self-extinguishing, resistant to radiation, solvents, and most chemicals, and is biocompatible. These outstanding properties make PEEK ideal for demanding applications, including precise electronic components, high-temperature and flame-resistant parts, and certain medical devices.
