Suggested Printing Parameters
| Nozzle temperature | 340 ~ 370℃ |
| Bed temperature | 140 ~ 220℃ |
| Chamber temperature | 90 ~ 200℃ |
| Bed modification | High temperature glue |
| Active cooling fan | OFF |
| Layer height | 0.2mm |
| Shell thickness | ≥ 0.8mm |
| Print speed | 30~60mm/s |
Technical Data Sheet (TDS)
| Material Properties | Typical Value | Test Method |
|---|---|---|
| Melt temperature (HDT)² | ~300℃ | ISO 11357 |
| Melt flow rate (MFR)¹ | 60~70g/10min | ISO 1133 |
| Heat deflection temperature (HDT)² | 168℃ | ISO 75 |
| Vicat softening temperature (VST)³ | 181℃ | ISO 306 |
| Density | 1.28g/cm³ | ISO 1183 |
| Odor | Odorless | / |
| Solubility | Insoluble in water | / |
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Weight options:
: 1kg, 3kg, 5kg
THE K12™ PEI 9085
THE K12™ PEI 9085 is a polyetherimide material with a relatively low molding temperature and excellent flow properties. This aerospace-proven material offers exceptional resistance to heat, flame, and chemicals, combined with high strength and toughness. These properties make PEI 9085 an ideal choice for demanding applications in various industries.
